A review of heat pipe technology for foldable electronic devices

Michael J. Gibbons; Marco Marengo; Tim Persoons

doi:10.1016/j.applthermaleng.2021.117087

A review of heat pipe technology for foldable electronic devices

Michael J. Gibbons, Marco Marengo, Tim Persoons

Advanced Engineering Centre

Research output: Contribution to journal › Article › peer-review

Abstract

The advent of foldable and wearable devices, such as the Samsung Galaxy Fold (2019) and Huawei Mate X (2019), require increased battery size and processor performance to drive their larger flexible displays. There is a growing need to develop flexible thermal management solutions to cool these foldable electronic devices. This research presents a comprehensive review of the state-of-the-art for both rigid and flexible ultra-thin heat pipe technology. This review discusses various types of heat pipes, their thermal performance, novel manufacturing processes, and the open research questions, challenges, together with the potential future directions of this research area.

Original language	English
Article number	117087
Pages (from-to)	1-26
Journal	Applied Thermal Engineering
Volume	194
DOIs	https://doi.org/10.1016/j.applthermaleng.2021.117087
Publication status	Published - 13 May 2021

Bibliographical note

Funding Information:
The authors would like to acknowledge the financial support of the Irish Research Council under Grant No. IRC/GOIPD/2019/666.

Keywords

Electronic cooling
Flexible heat pipe
Thermal ground plane
Thermal management
Thermal spreader
Vapor chamber

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10.1016/j.applthermaleng.2021.117087Licence: CC BY

1-s2.0-S1359431121005299-mainFinal published version, 6.5 MBLicence: CC BY

Cite this

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AU - Persoons, Tim

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AB - The advent of foldable and wearable devices, such as the Samsung Galaxy Fold (2019) and Huawei Mate X (2019), require increased battery size and processor performance to drive their larger flexible displays. There is a growing need to develop flexible thermal management solutions to cool these foldable electronic devices. This research presents a comprehensive review of the state-of-the-art for both rigid and flexible ultra-thin heat pipe technology. This review discusses various types of heat pipes, their thermal performance, novel manufacturing processes, and the open research questions, challenges, together with the potential future directions of this research area.

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A review of heat pipe technology for foldable electronic devices

Abstract

Bibliographical note

Keywords

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