Analytical and numerical modeling of microchannel heat sink

G. E. Cossali, D. A. Di Pietro, M. Marengo

Research output: Chapter in Book/Conference proceeding with ISSN or ISBNConference contribution with ISSN or ISBN

Abstract

Analytical and numerical tools for modeling microchannel heat sinks are presented, including the most important project parameters. An analytical 1D model, suitable for both design and performance calculations, is first developed under lumped capacitance assumption and resorting to standard correlations for Nu under HI boundary conditions. 2D model extensions are then provided separately for poorly and highly conductive substrates: in the former case axial conduction is neglected; in the latter case the 2D model is modified to include axial conduction by exploiting the results from ID model. This innovative approach provides a significant reduction in computational costs with respect to a conventional 3D model. A 3D model is then developed to evaluate the effects of thermal entrance. Finally, some optimization calculations are performed.

Original languageEnglish
Title of host publicationInternational Conference on Microchannels and Minichannels
EditorsS.G. Kandlikar
Pages713-720
Number of pages8
Publication statusPublished - 1 Dec 2003
EventFirst International Conference on Microchannels and Minichannels - Rochester, NY, United States
Duration: 24 Apr 200325 Apr 2003

Publication series

NameInternational Conference on Microchannels and Minichannels
Volume1

Conference

ConferenceFirst International Conference on Microchannels and Minichannels
CountryUnited States
CityRochester, NY
Period24/04/0325/04/03

Fingerprint

Heat sinks
Microchannels
Analytical models
Capacitance
Boundary conditions
Substrates
Costs

Cite this

Cossali, G. E., Di Pietro, D. A., & Marengo, M. (2003). Analytical and numerical modeling of microchannel heat sink. In S. G. Kandlikar (Ed.), International Conference on Microchannels and Minichannels (pp. 713-720). (International Conference on Microchannels and Minichannels; Vol. 1).
Cossali, G. E. ; Di Pietro, D. A. ; Marengo, M. / Analytical and numerical modeling of microchannel heat sink. International Conference on Microchannels and Minichannels. editor / S.G. Kandlikar. 2003. pp. 713-720 (International Conference on Microchannels and Minichannels).
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Cossali, GE, Di Pietro, DA & Marengo, M 2003, Analytical and numerical modeling of microchannel heat sink. in SG Kandlikar (ed.), International Conference on Microchannels and Minichannels. International Conference on Microchannels and Minichannels, vol. 1, pp. 713-720, First International Conference on Microchannels and Minichannels, Rochester, NY, United States, 24/04/03.

Analytical and numerical modeling of microchannel heat sink. / Cossali, G. E.; Di Pietro, D. A.; Marengo, M.

International Conference on Microchannels and Minichannels. ed. / S.G. Kandlikar. 2003. p. 713-720 (International Conference on Microchannels and Minichannels; Vol. 1).

Research output: Chapter in Book/Conference proceeding with ISSN or ISBNConference contribution with ISSN or ISBN

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AB - Analytical and numerical tools for modeling microchannel heat sinks are presented, including the most important project parameters. An analytical 1D model, suitable for both design and performance calculations, is first developed under lumped capacitance assumption and resorting to standard correlations for Nu under HI boundary conditions. 2D model extensions are then provided separately for poorly and highly conductive substrates: in the former case axial conduction is neglected; in the latter case the 2D model is modified to include axial conduction by exploiting the results from ID model. This innovative approach provides a significant reduction in computational costs with respect to a conventional 3D model. A 3D model is then developed to evaluate the effects of thermal entrance. Finally, some optimization calculations are performed.

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Cossali GE, Di Pietro DA, Marengo M. Analytical and numerical modeling of microchannel heat sink. In Kandlikar SG, editor, International Conference on Microchannels and Minichannels. 2003. p. 713-720. (International Conference on Microchannels and Minichannels).