Analytical and numerical modeling of microchannel heat sink

G. E. Cossali, D. A. Di Pietro, M. Marengo

    Research output: Chapter in Book/Conference proceeding with ISSN or ISBNConference contribution with ISSN or ISBNpeer-review

    Abstract

    Analytical and numerical tools for modeling microchannel heat sinks are presented, including the most important project parameters. An analytical 1D model, suitable for both design and performance calculations, is first developed under lumped capacitance assumption and resorting to standard correlations for Nu under HI boundary conditions. 2D model extensions are then provided separately for poorly and highly conductive substrates: in the former case axial conduction is neglected; in the latter case the 2D model is modified to include axial conduction by exploiting the results from ID model. This innovative approach provides a significant reduction in computational costs with respect to a conventional 3D model. A 3D model is then developed to evaluate the effects of thermal entrance. Finally, some optimization calculations are performed.

    Original languageEnglish
    Title of host publicationInternational Conference on Microchannels and Minichannels
    EditorsS.G. Kandlikar
    Pages713-720
    Number of pages8
    Publication statusPublished - 1 Dec 2003
    EventFirst International Conference on Microchannels and Minichannels - Rochester, NY, United States
    Duration: 24 Apr 200325 Apr 2003

    Publication series

    NameInternational Conference on Microchannels and Minichannels
    Volume1

    Conference

    ConferenceFirst International Conference on Microchannels and Minichannels
    Country/TerritoryUnited States
    CityRochester, NY
    Period24/04/0325/04/03

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